AAVID THERMALLOY

63-6546-29 Heatsink, BGA, 23.4°C/W, 28.58 (Dia.) x 9.14mm 34182

Features

  • BGA Heatsink, Radial Fin. Bond-on heatsinks for leadless chip carriers and flat-packs. Primarily designed for 68-pin devices Suitable for high-power LEDs

Spec

  • Quantity:1piece
  • For Use With : BGA
  • Height : 9.14mm
  • Dimensions : 28.58 (Dia.) x 9.14mm
  • Thermal Resistance : 23.4°C/W
  • Diameter : 28.58mm
  • Colour : Black
  • CODE No.:103-825
Order No. 63-6546-29
Model No. 34182
JAN Code 0000000000000
Standard price JPY: 19,200 USD: 170.74
Excange rate 1USD= 112.45JPY
Valid price in Japan
Quantity 1piece
Stock in Japan
Qty.